Applications Program Managers EoPlex Technologies
Job Duties: Design and evaluate semiconductor assembly process for Die attach, Wirebond and Mold equipments; Functionally and statistically evaluate materials and process combinations for semiconductor assembly; Conduct Design of Experiments (DOE) for IC package reliability qualification; Design lead frame using design software tools, specifically Autodesk AutoCAD software and I-DEAS; and review customer requirements and qualify EoPlex technology for market readiness.
Requirements: Masters? degree (or foreign equivalent degree) in Mechanical Engineering or Mechanical & Electronics Engineering and two years of experience as Sales & Technical Manager, Manager (R&D, QMS), Process Engineer or related occupation. Two years of experience must include experience with: Semiconductor assembly process development for Dicing, Die attach, Wire bond and Mold operations; and in lead frame design using design software tools, specifically, Autodesk AutoCAD software and I-DEAS.
Job Site:Eoplex, Inc., 2950 North First Street, San Jose, CA 95134
Hours:Full-time (40 hours per week)
Contact:Send resume to Eoplex, Inc., Attn: HR, 2950 North First Street, San Jose, CA 95134
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