Director, Hardware Engineering Quantum3D
THIS JOB HAS EXPIRED
Full-Time/Non-Exempt
Primary Job Function
The Company is actively seeking a qualified self-motivated professional Director of Hardware Engineering to design and develop electronic products for Quantum3D?s Embedded Visual Computing, Embedded High Performance Computing and Visual Simulation markets.
Direct hardware engineers/architects and systems engineers driving analysis and defining next-generation architectures for our products. We have an exciting & dynamic senior technical leadership position available with a focus on CPU, GPU, DSP, and multicore performance plus power, and thermals ? SWaP (Size Weight and Power) Optimized Computing.
The successful candidate will engage collaboratively across the company with SW, marketing, and product planning teams, and provide project management and technical leadership for a hardware team responsible for:
Performance, power and/or thermal analysis across relevant use cases, benchmarks and workloads across various tiers of Quantum3D products
Collaborating with other teams to define and update the appropriate benchmark set to be used to evaluate CPU and multicore performance and power
Devising and deploying data gathering and analysis methods to project future system performance, and driving the development of new analysis tools/models as needed
Understanding the interaction of HW with the OS and application code
Understanding industry directions in CPU, GPU, DSP, and multicore
Competitive analysis of competitive products
Invention of architectural enhancements and algorithms to optimize performance, power and/or thermals
Candidate may also be responsible FPGA firmware, and hardware design work, depending on the project. Candidate is expected to be capable of working on multiple projects simultaneously, balancing the workload between projects depending on schedule and urgency. The selected candidate must be a U.S. Citizen or have permanent resident status
Duties and Responsibilities
Direct hardware Engineering teams effort in:
High Speed digital design
FPGA architectural design and implementation
Thermal and Mechanical design analysis (with the aid of subcontractors)Creation and/or review of product proposals and functional specifications
Interface with manufacturing for board fabrication and support
Create documentation for internal and customer usage.
Adhere to the ISO/ITAR practices as appropriate
Mechanical Design
Industrial/Packaging Design
Knowledge, Skills, and Abilities:
Project planning/monitoring leadership, technical leadership, judgment, the ability to define, articulate, and drive a credible technical vision.
Superb communication skills and ability to interact and lead fluidly across as distributed organization, providing mentorship to junior engineers.
Experience engaging throughout the product design cycle, including architecture, HW design, verification and customer engagement
Top-notch expertise in computer architecture, with especially deep knowledge of modern CPU microarchitectural techniques, multicore, out-of-order, caches, memory controllers, interconnects, etc.
Experience in benchmarking & analysis for both performance and power
A track record in innovation including patents and/or publications.
10+ years experience in DSP and embedded systems development, preferably in the mobile market
Desirable Qualifications
C / C++
Experience in Intel, Nvidia, or ATI chipset designs advantageous
2 years+ Military, industrial or ruggedized high reliability design experience strongly preferred
Training and Experience Required:
Must have B.S. Degree in Computer/Electronic Engineering or equivalent. 10+ years of Project leadership and work experience as a director.
Compensation and Benefits:
Commensurate with experience; plus a comprehensive benefits package.
NO RELOCATION ASSISTANCE IS AVAILABLE. If you reside outside of the area and do not require relocation assistance, please indicate this on your cover letter.
| Location: |
6330 San Ignacio Avenue
San Jose, CA 95119
United States
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THIS JOB HAS EXPIRED