Manufacturing/ Process/ Device/Packaging Engineering - Internships (11784773) Freescale Semiconductor Inc.
THIS JOB HAS EXPIRED http://www.freescale.com/webapp/sps/site/overview.jsp?code=CAREERSUSAHOME
Primary Location: US-TX-Austin-Oak Hill (TX30) US-AZ-Tempe (AZ34), US-AZ-Chandler (AZ50)
Job Field: Intern/Co-op/Temp
Education Level: Bachelor's Degree
Job Type: Internship
Relocation Available?: Yes
Freescale is a global leader in microcontrollers and digital networking processors for the automotive, networking, industrial and consumer markets. Our vast portfolio of products includes 8 and 16-bit MCUs, 32-bit MCUs and processors, analog and power-management, RF and sensing solutions. Freescale technology makes the things you use every day smarter, from e-readers and energy meters, to medical equipment and cars, to home appliances, computer networks and more. Today, Freescale is leading the charge to help bring the Internet of Things to life ? a new world in which everyday objects not only connect but cooperate with each other, humans, environments and infrastructures. Freescale Connected intelligence reflects our collaborative approach to enabling this next wave of innovation. Whether it's the hardware and software solutions we make, the partnerships we forge, or the expertise we provide, Connected Intelligence is helping our customers turn the Internet of Things into reality. Life at Freescale includes a great boss, a great job and great rewards, all built on a foundation of ethics, customer focus and innovation. Joining our team means working with some of the most passionate, knowledgeable and collaborative people in the world, who care about making a difference.
Freescale has a number of opportunities for Manufacturing, Process, Device or Packaging internships ? areas include Industrial Engineering, Process Engineering, Device Engineering, Equipment Engineering and Packaging Engineering.
Must be currently pursuing a Bachelor?s degree or Master?s degree in the area of Electrical Engineering, Materials Science, Solid State Physics, Chemical Engineering or Mechanical Engineering with a GPA of 3.25 or higher
Familiarity with statistical process control, device parametrics, etch, design of experiments, integrated circuit silicon technology or packaging technology structure
Previous internships or industry experience in manufacturing is preferred
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THIS JOB HAS EXPIRED