Packaging Engineer - New College Graduates (11784802) Freescale Semiconductor Inc.
THIS JOB HAS EXPIRED Primary Location: US-TX-Austin-Oak Hill (TX30) US-AZ-Tempe (AZ34), US-AZ-Chandler (AZ50)
Job Field: Packaging
Education Level: Bachelor's Degree
Job Type: Recent Graduate
Relocation Available?: Yes
Freescale is a global leader in microcontrollers and digital networking processors for the automotive, networking, industrial and consumer markets. Our vast portfolio of products includes 8 and 16-bit MCUs, 32-bit MCUs and processors, analog and power-management, RF and sensing solutions. Freescale technology makes the things you use every day smarter, from e-readers and energy meters, to medical equipment and cars, to home appliances, computer networks and more. Today, Freescale is leading the charge to help bring the Internet of Things to life ? a new world in which everyday objects not only connect but cooperate with each other, humans, environments and infrastructures. Freescale Connected intelligence reflects our collaborative approach to enabling this next wave of innovation. Whether it's the hardware and software solutions we make, the partnerships we forge, or the expertise we provide, Connected Intelligence is helping our customers turn the Internet of Things into reality. Life at Freescale includes a great boss, a great job and great rewards, all built on a foundation of ethics, customer focus and innovation. Joining our team means working with some of the most passionate, knowledgeable and collaborative people in the world, who care about making a difference.
Freescale has a number of opportunities for Packaging Engineers. Within Freescale?s Technology Solutions Organization (TSO), the Packaging Solutions Development group (PSD) is responsible for the implementation of packaging solutions for new product introduction and the development of new packaging technologies, including Sensor and Analog Products, Automotive MCU Products and Microcontrollers. As a Packaging Engineer, you will have the opportunity to integrate packaging technologies into compelling product solutions.
Bachelor?s, Master?s or Doctoral degrees in Mechanical Engineering, Materials Science, Electrical Engineering, Physics or related fields, with a GPA of 3.25 or higher
Familiarity with electronic packaging
Familiarity with electronic package assembly processes
Familiarity with electronic package materials (metals, ceramics, polymers)
Ability to read mechanical drawings
Ability to generate drawings using CAD software is a plus
Experience with thermal, mechanical or electrical modeling is a plus
Familiarity with failure analysis techniques
A sound background in experimental design and statistics
Understanding of project management is a plus
Strong analytical and problem-solving skills with independent judgment to deal with ambiguity
Strong collaboration, communication and presentation skills
Results-oriented contributor who can demonstrate business acumen and resourcefulness
||Austin, TX |
THIS JOB HAS EXPIRED