Packaging Engineer - Optoelectronic Devices Princeton Lightwave
We are looking for opto-mechanical packaging talent that can help unleash the market leading performance of our detectors and lasers. The ideal candidate is one who is passionate about optical packaging and product delivery in a fast paced, dynamic environment, and can drive concept and detailed design of all packaging aspects of our products. Experience in integration of optical chips, fiber, bulk optics, electronics and cooling to deliver high performance products is critical. Desirable functional skill sets include:
Mechanical design
Opto-mechanics and opto-electronic integration skills
Thermal analysis
Materials engineering
Process knowledge in areas of flip chip bonding, wire bonding, die bonding and laser welding
Qualifications: Preferred educational background includes a M.S. in Mechanical or Materials Engineering.
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2555 Route 130 South
Cranbury, NJ 08512
United States
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