Inphi Corporation, a high-speed analog semiconductor company, is the market leader in data transport and signal integrity solutions from fiber to memory. We address the bandwidth, capacity and power issues faced by cloud computing, mega data center, and 40G/100G network environments. By leveraging our core competencies in advanced analog circuit design, signal integrity, power management, packaging and process technologies, Inphi has taken a leadership role in the markets we serve. Founded in 2001, Inphi went through a successful initial public offering in November 2010 and is publicly traded on NYSE under the symbol ?IPHI.?
Our innovative approaches have resulted in the company?s products being first to market in a number of key areas, including 40G/100G drivers and TiAs, as well as 100G Ethernet CMOS SERDES. We are seeking talented individuals to work on demanding technical challenges with the most outstanding group of collaborators in the industry. Join our team of experts and make a difference in an exciting career opportunity.
Inphi is seeking a Principal Enginee, System in Package, who will be responsible for the specification development and integration of high speed multi-chip module that significantly increases the bandwidth of next-generation of communications infrastructures. This position will perform lead systems engineering, systems architect, and systems analysis roles on programs for the development of high-performance multi-chip module. This position will work on projects end-to-end ? from proposal and design, through prototype development and analysis, to product development and manufacturing. This position will work with a small, multi-disciplined, highly energetic, and technically ambitious team.
PhD degree in Electrical Engineering in the area of IC design for high-speed analog and mixed-signal ICs with 6+ years of experience, or Masters with 10+ years of experience
Expert in fundamentals of circuits, transmission lines, EM, and microwave theory
Expert in developing electro-optical systems
Have extensive experience with the design, development, and analysis of optical / electro-optical systems
Measure IC performance and debug design
Expert knowledge of circuit and EM simulation tools: Cadence/ADE, ADS, HFSS,
IE3D, SI-Wave, Momentum
Skilled with VNA and time domain measurements for IC characterization