Principal Packaging and Assembly Engineer Peregrine Semiconductor
THIS JOB HAS EXPIRED Peregrine Semiconductor Corporation (NASDAQ: PSMI) is a fabless provider of high-performance radio frequency integrated circuits (RFICs) based upon its patented UltraCMOS technology. UltraCMOS enables high linearity, high speed, low power consumption, and small design size for wireless applications in the commercial, industrial, space, defense, test-and-measurement, wireless-infrastructure, and broadband markets, among others. From the mobile wireless device you use every day, to satellites in space, Peregrine Semiconductor is Changing RF Design. Forever.?
Peregrine Semiconductor is a publicly-held company with a fast growth rate. The Company?s unique technology and potential for professional advancement make this an excellent career opportunity for innovative and goal-oriented individuals.
Note: The Peregrine Semiconductor name and logo are registered trademarks, and Changing RF Design. Forever.? a trademark of Peregrine Semiconductor Corporation in the U.S.A., and other countries. All other trademarks mentioned herein are property of their respective owners.
Select, characterize and qualify packages for new RFIC product release.
Roles & Responsibilities
This position has responsibility for:
Select packages for new product release based on product line requirements
Define appropriate bill of materials for new packages at production assembly suppliers
Oversee interactions with non-production prototype assembly suppliers
Ensure proper assembly process characterization of proposed package BOM
Propose and qualify new package technologies
Knowledge, Skill and Competency Requirements
Competency is based on: education, training, skills and experience. In order to perform the job successfully, an individual should demonstrate the following knowledge, skills and competencies:
Deep understanding of flip chip assembly
Deep understanding of wafer bumping technology
Deep understanding of laminate substrate technology
Deep understanding of assembly process characterization
Experience with copper wire bond technology
Experience with Wafer Level Packaging Technology
Understanding of the package layout process
Ability to communicate with and work with domestic and Asian contract package suppliers
Experience with Autocad
The following traits are highly valued:
Strong communication skills
Experience with Design for Manufacturability
Strong team player
Education and Experience:
Bachelors or Master?s degree in electrical or mechanical engineering.
10 plus years of experience with IC package and assembly development
||9450 Carroll Park Drive |
San Diego, CA 92121
THIS JOB HAS EXPIRED