Minimum: Bachelors degree in engineering, physics, or material science with 10+ years experience in assembly manufacturing and quality for high speed multi-chip modules used in telecommunications equipment.
Hands on skill in reflow, wire bonding, and dispense tools and processes
Knowledge of SPC and production control.
Expert knowledge and experience developing high yield, high quality, manufacturable hybrid multichip module assembly processes for both hermetic and non-hermetic packaging.
Audit experience for sub-contractor compliance to assembly requirements.
Management of a CAR process including verification of effectiveness to drive defect analysis and improvements.
Identification of opportunities for improvement, driving implementation of improvements and/or monitoring progress at sub-contractors
Experience defining and implementing QA/QC requirements, training, data review and analysis.
Definition, documentation, and training of inspection criteria.
Strong writing, speaking, and presentation skills
Good team work skills that facilitate effective participation in cross functional teams as they define and implement product assembly and BOM requirements.
Ability to work independently as well as in teams
Ability to work across functions and levels.
Westlake Village, CA 91361