Inphi Corporation, a high-speed analog semiconductor company, is the market leader in data transport and signal integrity solutions from fiber to memory. We address the bandwidth, capacity and power issues faced by cloud computing, mega data center, and 40G/100G network environments. By leveraging our core competencies in advanced analog circuit design, signal integrity, power management, packaging and process technologies, Inphi has taken a leadership role in the markets we serve. Founded in 2001, Inphi went through a successful initial public offering in November 2010 and is publicly traded on NYSE under the symbol ?IPHI.?
Our innovative approaches have resulted in the company?s products being first to market in a number of key areas, including 40G/100G drivers and TiAs, as well as 100G Ethernet CMOS SERDES. We are seeking talented individuals to work on demanding technical challenges with the most outstanding group of collaborators in the industry. Join our team of experts and make a difference in an exciting career opportunity.
Inphi is seeking an experienced High-Speed Package Design engineer for its fast growing line of products for memory, telecom, datacom, computing and test measurement applications. The successful candidate will work at Inphi facility in Westlake Village, CA.
The High-Speed Package Design engineer will be responsible for package electrical design, modeling and characterization, including all signal and power integrity aspects. He will develop accurate package models for IC-package co-design, taking into account manufacturing and assembly tolerances. The engineer will interface with package supplier to select package technology, drive layout, ensure manufacturability, and meet thermal, mechanical, electrical, and cost requirements, within development schedule. He will interface with signal integrity engineers to define achievable package specs, with IC designers to optimize IC-package performance, implement models for SSO and power integrity analysis, and with PCB layout engineers to optimize package footprint and assembly on PCB.
MS.EE with 8+ years of experience in related area or Ph.D.EE with 6+ years of experience
Strong fundamentals of transmission lines, EM, and microwave theory
Experience with high-speed electronic packaging for digital and analog ICs
Experience with packaging technologies, materials, package substrate design rules and assembly rules
Experience with VNA and TDR measurements for packages and PCBs characterization
Experience in using 2-D and 3-D EM simulation tools such as HFSS, SI-Wave, Momentum, IE3D, CST, PowerSI
Working knowledge of circuit design tools: Spectre, ADS, HSpice, Designer
Proven track record of new product introduction from concept, through development and production
Familiar with package manufacturing and assembly processes
Familiar with layout tools (APD, PADS)
Independently generate accurate and passive models of IC packages and PCBs and use them in circuit simulators such as Cadence and ADS for IC-Package-PCB co-simulation
Independently analyze package and PCB structures and build simplified models for EM analysis capturing correctly electrical behavior
Good package and PCB debugging and troubleshooting
Effective communication and team player
Efficiently leverage package vendors design services.