Technical Associate Princeton Lightwave
Perform packaging and characterization of semiconductor laser diodes/modules and detectors. Preferred packaging skills include die bonding, wedge/wire/ribbon bonding, fiber alignment, laser welding and vacuum reflow. Desirable characterization skills include material inspection, device performance testing, burn-in and reliability. The candidate should have experience in the opto-electronic industry, including the ability to read and understand drawings and bills of material, and ability to handle micron level components. Proficiency with Microsoft software (Word, Excel) required. Experience with maintaining opto-electronic production equipment a plus.
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2555 Route 130 South
Cranbury, NJ 08512
United States
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