Thermal Modeling Intern (11786998) Freescale Semiconductor Inc.
THIS JOB HAS EXPIRED Primary Location: US-TX-Austin-Oak Hill (TX30)
Job Field: Intern (technical)
Education Level: Bachelor's Degree
Job Type: Internship
Relocation Available?: Yes
Freescale Inc., www.freescale.com, is a global leader in the design and manufacture of embedded semiconductors for the automotive, consumer, industrial, networking and wireless markets. Freescale is based in Austin, Texas, and has design, research and development, manufacturing or sales operations in more than 30 countries. Freescale is one of the world?s largest semiconductor companies.
Within Freescale?s Technology Solutions Organization (TSO), the Packaging Solutions Development group (PSD) is responsible for the implementation of packaging solutions for new product introduction and the development of new packaging technologies including Sensor and Analog Products, Automotive MCU Products and Microcontrollers. This posted position will report to the Package Modeling Development Manager within PSD responsible for mechanical modeling of electronic packages and will be located in Austin, Texas.
The scope of this internship is the development of a database supporting thermal evaluation of semiconductor packages. That will include the generation of a new web based user interface for searching the database effectively and providing all necessary information to the user. The candidate will learn thermal engineering fundamentals to understand the significance of all parameters and create custom graphs for parametric variation.
Candidate is currently pursuing Masters of Science in Computer Science.
Proficient with LAMP (Linux, Apache, MySQL, Perl/PHP/Python) architecture for creating database and doing web page integration.
Knowledge of thermal mechanical engineering fundamentals is plus.
Good written and verbal communication skills.
||Austin, TX |
THIS JOB HAS EXPIRED