R&D Packaging Engineer Applied Optoelectronics
THIS JOB HAS EXPIRED Job Code:OMDPCK1801
This position is to build up PLC/ AWG technologies include some MEMS options. This position is also required to design and improve current products and process (LASER related packaging). Candidates required strong experience in PLC/ AWG material and process, well knowledge in epoxy package technology. More than three years in optical communication industry is preferred.
Build PLC/AWG related packaging technologies
Approach optical MEMS related process
Current product/ process (LASER devices and module) improve
Current production line technical support
Education: Master and higher at Material, Physics, EE, ME
Experience: More than 3 yrs experience in PLC/ AWG growth and package products.
Other: : MEMS experience is a plus
||13111 Jess Pirtle Boulevard |
Sugar Land, TX 77478
THIS JOB HAS EXPIRED