Staff Engineer, Package/Substrate Design Peregrine Semiconductor
THIS JOB HAS EXPIRED Peregrine Semiconductor Corporation (NASDAQ: PSMI) is a fabless provider of high-performance radio frequency integrated circuits (RFICs) based upon its patented UltraCMOS technology. UltraCMOS enables high linearity, high speed, low power consumption, and small design size for wireless applications in the commercial, industrial, space, defense, test-and-measurement, wireless-infrastructure, and broadband markets, among others. From the mobile wireless device you use every day, to satellites in space, Peregrine Semiconductor is Changing RF Design. Forever.?
Peregrine Semiconductor is a publicly-held company with a fast growth rate. The Company?s unique technology and potential for professional advancement make this an excellent career opportunity for innovative and goal-oriented individuals.
Note: The Peregrine Semiconductor name and logo are registered trademarks, and Changing RF Design. Forever.? a trademark of Peregrine Semiconductor Corporation in the U.S.A., and other countries. All other trademarks mentioned herein are property of their respective owners.
Staff Engineer, Package Substrate Design, HPS
The candidate will focus on the development of substrates/modules for high performance RFIC products such as Switches, DTCs, Attenuators, RF Power Amplifiers, Mixers, etc. The candidate will work with packaging engineers or packaging and substrate manufacturers, RFIC design engineers to deliver substrate or multi-chip module design with various packages and material.
The candidate must possess thorough understanding of electromagnetic theory, RF circuit design and use of RF lab equipment to characterize RF products.
Roles & Responsibilities
This position has responsibility for:
Design and characterization of RFIC matching circuits in various substrate technologies
Create prototype circuits for customer demonstration
Work closely with and support RFIC designers
Design passive circuits for optimal performance, such as low loss matching circuits, high isolation substrate, RF filters, high directivity couplers, etc.
Design layout, carry out simulation and data analysis with EM tools such as ADS, HFSS, etc.
Use of lab equipment to validate fabricated substrate
Work with packaging, modeling, CAD groups in building company?s infrastructure for package/module/substrate design
Knowledge, Skill and Competency Requirements
Competency is based on: education, training, skills and experience. In order to perform the job successfully, an individual should demonstrate the following knowledge, skills and competencies:
Knowledge of electromagnetic theory, RF/Microwave circuit fundamentals
Strong knowledge and skills in designing passive components, such as RLC filter, transmission lines, waveguides, sufficient in layout and schematic capture, EM & circuit simulation and analysis
Good communicator using clear documentation of design progress, decisions and results
Sense of urgency to complete assignments on schedule
Knowledge and experience of RF Lab measurement and calibration techniques
The following traits are highly valued:
Basic knowledge of antennas, RF amplifiers, filters and switches
Knowledge of different package types and substrate materials
Knowledge of design rules of substrate and packaging
Knowledge of IC/substrate/packaging manufacturing process
Team-work; willingness to go beyond what is being asked
Education and Experience:
Relevant experience of 7+ years in package IC design and EM co-simulation.
||9450 Carroll Park Drive |
San Diego, CA 92121
THIS JOB HAS EXPIRED